LSI用Alパッドに対するジンケート前処理のシミュレーション実験

概要

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Small Al electrodes connected to the pins of a model IC were subjected to zincate pretreatment to simulate the plating process in an LSI manufacturing line. From SEM observation, deposition of Zn and dissolution of Al substrate depended on the potential of Al electrodes under the potentiostatic polarization in the zincate solution. Difference in electric impedance of IC pins affected the immersion potenial of Al electrodes in the zincate solution and thus the amount of Zn deposition. Visible light illumination on the separated p-Si electrode additionally connected to the power supply pin of the IC generated photocurrent. This caused a shift in immersion potential of Al electrodes connected to the other pins of the IC in a noble direction, resulting in suppression of Zn deposition in the zincate pretreatment.
社団法人表面技術協会の論文
2003-06-01