めっきで形成した銅バンプとはんだとの接合部の高温耐久性

概要

論文の詳細を見る
Exposure time effect on solder-joint pull between a substrate and a copper bump at 150°C was studied. Copper bumps formed in a copper sulfate plating bath are well known to be reliable in semiconductor electrode applications, but are still being studied for applications in the automotive industry. SEM confirmed that voids caused by Cu-Sn diffusion grew at the interface between the copper layer and Cu-Sn alloy layer after durability testing at 150°C. EPMA showed that sulphur segregation occurred near the void and that voids grew in proportion to the sulphur concentration. Small amounts of sulphur remaining in copper bumps are thought to diffuse with vacancies at the interface and promote void growth. To improve reliability, sulphur concentration at copper bumps should be suppressed during copper sulfate plating.
社団法人表面技術協会の論文
1999-11-01