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Univ. Arizona Az | 論文
- Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
- Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
- Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
- Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
- Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization