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Precision and Intelligence Laboratory, Tokyo Institute of Technology | 論文
- On-chip Spiral Inductors Integrated with Wafer-Level Package
- Displacement Analysis of Pantograph Mechanisms with Superelastic Hinges
- Design System of Superelastic Hinges and Its Application to Micromanipulators
- Development of Mechanical Systems for Micro-Bonding by Adhesive : Proposal of Micro-Application Technology of Adhesive Resin
- Fatigue Tests of Ni-P Amorphous Alloy Microcantilever Beams
- Rotational Vibration of a Helical Gear Pair Having Tooth Surface Deviation during Transmission of Light Load
- Fabrication of Micro-Aperture Surface Emitting Laser for Near Field Optical Data Storage
- Novel thermographic method for characterizing transformation temperatures of thin-film shape memory alloys aimed at combinatorial approach
- Semi-Supervised Learning to Classify Evaluative Expressions from Labeled and Unlabeled Texts(Knowledge, Information and Creativity Support System)
- High-Power CW Operation of GalnAsP/InP Superlumlnescent Light-Emitting Diode with Tapered Active Region : Optics and Quantum Electronics
- Reconstruction of Acoustic Impedance Distribution of Functionally Gradient Materials by Using Reflection Response : Ultrasonic Measurement
- High-Temperature Creep Behavior in Ni_3(Al, Ta)Single Crystals with Different Orientations
- Solid Source Dry Etching Process for GaAs and InP
- Iodine Solid Source Inductively Coupled Plasma Etching of InP
- Vertical and Smooth Microfabrication of InP Using Simple High-Density Plasma System with SmCo Ring Magnet
- Low-Temperature Dry Etching of InP by Inductively Coupled Plasma Using HI/Cl_2
- Cl_2-based Inductively Coupled Plasma Etching of InP Using Internal Antenna
- Measurement of Plasma Density for Control of Etching Profile in Inductively Coupled Plasma Etching of InP
- Acoustic and Vibrating Properties of C/C Composite
- Growth of Crystalline SrTiO_3 Films on Si Substrates Using Thin Fluoride Buffer Layers and Their Electrical Properties