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National Cheng Kung Univ. Tainan Twn | 論文
- Nanoscale Impact Dynamics Using Molecular Dynamics Simulation
- Effects of Graphite, SiO_2, and Fe_2O_3 on the Crushing Strength of Direct Reduced Iron from the Carbothermic Reduction of Residual Materials
- Examination of the Tensile Deformation Resistance and Ductility of Friction Stir Processed Al-Cu 2218 Alloy at Elevated Temperatures
- Platonin, a Photosensitizing Dye, Improves Circulatory Failure and Mortality in Rat Models of Endotoxemia
- The Protective Effects of PMC against Chronic Carbon Tetrachloride-Induced Hepatotoxicity in Vivo
- Nanoscale Impact Dynamics Using Molecular Dynamics Simulation
- The Charge-Discharge Characteristics of Woody Carbon Modified with Fe_3O_4 Nano Phase Using the Hydrothermal Method
- Microstructural Characteristics and the Charge-Discharge Characteristics of Sn-Cu Thin Film Materials
- Electric Flame-Off Characteristics and Fracture Properties of 20μm Thin Copper Bonding Wire
- Weibull Statistics for Evaluating Failure Behaviors and Joining Reliability of Friction Stir Spot Welded 5052 Aluminum Alloy
- Mechanical Properties and Resonant Characteristics of Friction Stirred AZ31-Mg Alloy
- The Recrystallization of Microelectronic Lead-Free Solders
- Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders
- Microstructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders
- Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders
- The Effect of Electrical Current on Tensile Properties and Vibration Characteristics of Sn-9Zn-1Cu Lead-Free Solder
- Electrochemical Characteristics of LiMn_2O_4 (Li/Ni) Cathode Materials
- Recrystallization Effect and Electric Flame-Off Characteristic of Thin Copper Wire
- Thin Film Characteristics of Sn-3.5Ag-(2.0Cu) Alloy
- Phase Transformation of an Austempered Ductile Iron during an Erosion Process