スポンサーリンク
Micro Device Division, Hitachi Ltd. | 論文
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects