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LSI Research Center, Kawasaki Steel Corporation | 論文
- Conformal Chermical Vapor Deposition TiN(111) Film Formation as an Underlayer of Al for Highly Reliable Interconnects
- Characterization of Direct-Contact Via Plug Formed by Using Selective Aluminum Chemical Vapor Deposition
- Relationship between Water Diffusivity of Dielectric Films and Accelerated Hot Carrier Degradation Caused by Water
- Water Diffusivity of Dielectric Films Evaluated with Use of D_2O
- Self-Aligned Rapid Thermal Nitridation of TiSi_2 in NH_3 Ambient as a Diffusion Barrier Layer for Selective CVD-Al Contact Plug Formation