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Joining and Welding Research Institute, Osaka University | 論文
- Microstructure and Tensile Properties of Sn-3.0Ag-0.5Cu Bulk Solders with Minor Additive of Co and Ni
- Electrical Characteristics of a New Class of Conductive Adhesive
- Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive
- Analysis of Inclusion Core under the Weld Pool of High Strength and Lowalloy Steel
- Laser Welding of Lotus-Type Porous Iron
- Microstructure of Bonding Interface for Resistance Welding of Zr-Based Metallic Glass Sheets
- Steroidal Saponins from Rhizomes of Tupistra wattii HOOK. f.
- Formation of strontium-doped lanthanum manganite (La_Sr_MnO_3) by mechanical milling without media balls
- Microcapsule assembly of single-walled carbon nanotubes from spray-dried hollow microspheres
- Pulsed Laser Irradiation for Triggered Discharge in Arc Welding System
- Efficient dispersing and shortening of super-growth carbon nanotubes by ultrasonic treatment with ceramic balls and surfactants
- Towards sustained delivery of small molecular drugs using hydroxyapatite microspheres as the vehicle
- Immobilization of highly-dispersed single-walled carbon nanotubes in biocompatible and water-soluble solid matrix
- Metallurgical and Mechanical Properties of High Nitrogen Austenitic Stainless Steel Friction Welds
- Material-binding peptide application-ZnO crystal structure control by means of a ZnO-binding peptide(ENZYMOLOGY, PROTEIN ENGINEERING, AND ENZYME TECHNOLOGY)
- 408 REACTION SYNTHESIS OF NiAl-TiC COMPOSITES AND IN-SITU JOINING TO Ni_3Al ALLOYS
- Intermediary Layer of Titanium Oxide in Al_2O_3/Cu Joint Using Amorphous Cu-Ti Filler Metals
- Analytical Approach to Anode Boundary Layer of Gas Tungsten Arcs
- Preface
- Conditions for the Measurement of Surface Tension of Solders with a Wetting Balance Tester(Materials, Metallurgy & Weldability)