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Graduate school of Mechanical Engineering, Pusan National University | 論文
- Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing
- Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning
- Prediction of Real Contact Area from Microtopography on CMP Pad
- Observability Analysis Techniques on Inertial Navigation Systems
- Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits
- Pad Characterization and Experimental Analysis of Pad Wear Effect on Material Removal Uniformity in Chemical Mechanical Polishing