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ELTRAN Project, Device Development Center, Canon Inc. | 論文
- Comparison in Splitting Bonded SOI by Solid and Fluid Wedges (Water and Air Jets)
- Current Progress in Epitaxial Layer Transfer (ELTRAN^[○!R]) (Special Issue on SOI Devices and Their Process Technologies)
- Advanced Quality in Epitaxial Layer Transfer by Bond and Etch-Back of Porous Si
- Extremely High Selective Etching of Porous Si for Single Etch-Stop Bond-and-Etch-Back Silicon-on-Insulator