スポンサーリンク
Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University | 論文
- Development of Power Supply System for Three-Dimensionally Staked Retinal Prosthesis Chip
- Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs
- Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
- Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis by Using Platinum-Black (Pt-b) Stimulus Electrode Array
- Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration
- Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis
- Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
- Ultimate Functional Multi-Electrode System (UFMES) Based on Multi-Chip Bonding Technique
- Retinal Prosthesis System with Telemetry Circuit Controlled by Human Eyelid Movement
- Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration
- New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
- 1P-317 プライマー伸長にともなう鎖置換で動作するDNA状態機械のシグナル制御(バイオエンジニアリング,第46回日本生物物理学会年会)