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Department of Precision Engineering, School of Engineering, University of Tokyo | 論文

• Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs with Au-Au Surface Activation
• Improved design methodology for an existing automated transportation system with automated guided vehicles in a seaport container terminal
• A Release Property of High-Permittivity Thin Film Manufactured with Nano-Transfer Method
• Study on Homogeneous Wafer Level Dielectric Film Preparation Using Chemical Solution Deposition Method
• Homogenizing and Applying Dielectric Film to Wafer-Level Film Preparation
• Study on Homogeneous Wafer Level Dielectric Film Preparation Using Chemical Solution Deposition Method

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