A Release Property of High-Permittivity Thin Film Manufactured with Nano-Transfer Method

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概要

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• It is useful to be able to further miniaturize printed wiring boards (PWBs) to achieve more compact and multi-functional mobile electronics. Since about 40–50% of the surface of a PWB is covered with passive elements such as capacitors, it is clear that miniaturization would improve performance. On the other hand, PWBs have a low temperature resistance, and thus the boards cannot use capacitors that require higher processing temperatures. The nano-transfer method, which consists of release and transfer steps, solves this problem. After the capacitor is fabricated on a high-temperature-resistant substrate, it is released from the substrate and mounted on the PWB. The purpose of this study is to clarify the release process in order to establish a fabrication technology for embedded substrates.

著者

• IIMURA K.

  Department of Mechanical and System Engineering, University of Hyogo

• Suga T.

  Department Of Dermatology Kagoshima University Faculty Of Medicine

• Ichiki M.

  Department of Precision Engineering, School of Engineering, University of Tokyo

• Hosono T.

  Department of Precision Engineering, School of Engineering, University of Tokyo

• Itoh T.

  National Institute of Advanced Industrial Science and Technology (AIST)

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