スポンサーリンク
Department of Materials Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan | 論文
- Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
- Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects