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Department of Materials Science and Engineering, Hongik University | 論文
- Spheroidization of Low Carbon Steel Processed by Equal Channel Angular Pressing
- Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films
- Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
- Joule-Heating-Induced Annealing by Applying Electric Field Directly to Intrinsic Silicon Film
- Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin
- Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding
- Thermoelectric Characteristics of n-Type Bi_2Te_3 and p-Type Sb_2Te_3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications