スポンサーリンク
Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology, Kitami, Hokkaido 090-8507, Japan | 論文
- Reactively Sputtered Nanocrystalline ZrN Film as Extremely Thin Diffusion Barrier between Cu and SiO2
- Preferentially Oriented Cu[111] Layer Formed on Thin Nb Barrier on SiO2
- Evolution of Microstructures in Nanocrystalline VN Barrier Leading to Failure in Cu/VN/SiO2/Si Systems