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Department Of Quantum Science And Energy Engineering Tohoku University | 論文
- Relationship Between the Liquidus Surface and Structures of Zr-Cu-Al Bulk Amorphous Alloys
- Oxygen Embrittlement and Effect of the Addition of Ni Element in a Bulk Amorphous Zr-Cu-Al Alloy
- Rotating-Beam Fatigue Properties of Pd_Cu_Ni_P_ Bulk Glassy Alloy
- Enhancement of Ductility and Plasticity of Zn_Cu_Al_Ni_5 Bulk Glassy Alloy by Cold Rolling
- Growth of a Single Al_Cu_Fe_ Icosahedral Quasicrystal Using the Czochralski Method and Annealing Removal of Strains
- Fatigue Properties and Microstructures of Zr_Cu_Al_Ni_5 Bulk Glassy Alloys
- Preparation of Large Grained AL_Cu_Fe_ Icosahedral Quasivrystal Directly from the Melt
- Growth of Icosahedral Single Quasicrystal and 1/1-Cubic Approximant Single Crystal in an Al-Li-Cu Alloy System by the Czodhralski Method
- Nanocrystalline Zr-Based Bulk Glassy Alloys with High Flexural Strength
- Rotating-Beam Fatigue Strength of Pd_ Cu_ Ni_ P_ Bulk Amorphous Alloy
- Measurements and Calculations of Neutron Energy Spectra Behind Polyethylene Shields Bombarded by 40- and 65-MeV Quasi-Monoenergetic Neutron Sources
- c-Axis-Correlated Vortex Pinning Center Induced by Dilute Co-doping in Pulsed-Laser-Deposition-ErBa_2Cu_3O_y Films
- Enhancement of Flux-Pinning in Epitaxial Sm_Ba_Cu_3O_y Films by Introduction of Low-T_c Nanoparticles
- High-Critical-Current-Density SmBa_2Cu_3O_ Films Induced by Surface Nanoparticle
- Effect of Regional Tracer Delay on CBF in Healthy Subjects Measured with Dynamic Susceptibility Contrast-Enhanced MRI : Comparison with ^O-PET
- PET measurements of CBF, OEF, and CMRO_2 without arterial sampling in hyperacute ischemic stroke : Method and error analysis
- Use of reference tissue models for quantification of histamine H_1 receptors in human brain by using positron emission tomography and [^C]doxepin
- Atmospheric Turbid Conditions due to Fine Particles in Recent Years at Nagasaki, Japan
- A 0.7-μm-Pitch Double Level Al Interconnection Technology for 1-Gbit DRAMs using SiO_2 Mask Al Etching and Plasma Enhanced Chemical Vapor Deposition SiOF
- A Reliable Double Level Interconnection Technology for Giga Bit DRAMs Using SiO_2 Mask Al Etching and PECVD SiOF