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Communications Research Laboratory Ministry Of Posts And Telecommunications | 論文
- A Dynamic TDMA Wireless Integrated Voice/Data System with Data Steal into Voice (DSV) Technique
- Selective Dry Etching of AlGaAs-GaAs Heterojunction
- Airborne Dual-Frequency Polarimetric and Interferometric SAR(Special Issue on Advances in Radar Systems)
- A Large Variable Ratio On-Chip Inductor with Spider Legs Shield
- Wide Tuning Range LC-VCO Using Variable Inductor for Reconfigurable RF Circuit(Analog Circuit Techniques and Related Topics)
- Small Area Snake Inductor on Si RF CMOS Chip
- On-chip Spiral Inductors Integrated with Wafer-Level Package
- On the Synthesis of the Generalized Cascaded Lossless Bounded Real (LBR) Digital Filter Structures
- On the Lossless II-Cascade Synthesis of a Bounded Complex Digital Filter
- Factored State Space Derivation of Low Sensitivity Digital Filter Structures
- Field Experiments on 16QAM/TDMA and Trellis Coded 16QAM/TDMA Systems for Digital Land Mobile Radio Communications (Special Issue on Personal, Indoor and Mobile Radio Communications)
- Millimeter-Wave Wireless-LAN System Employing Compact and Cost-Effective 156Mbps Transceiver MCMs(Special Issue on Microwave and Millimeter Wave Technology)
- Rigorous Analysis of a Loop Antenna System for Magnetic Interference Measurement
- The Feasibility Study of the Dynamic Zone Configuration Technique with a Developed Circular Array Antenna (Special Section on Multi-dimensional Mobile Information Networks)
- Channel State Dependent Resource Scheduling for Wireless Message Transport with Framed ALOHA-Reservation Access Protocol(Special Section on Multi-dimensional Mobile Information Networks)
- Special Issue on Innovation in Antennas and Propagation for Expanding Radio Systems
- An Active Different-Sized Cell Combination Method (ADCC) for Street Microcellular Systems (Special Section on Multi-dimensional Mobile Information Networks)
- C-2-82 Broadside 3-dB Tandem Coupler Using WLP Technology for 60 GHz Applications
- Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology(Microwaves, Millimeter-Waves)
- On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP