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Applied Materials, Inc. | 論文
- CuAl合金シードを用いたCu配線の信頼性改善
- Decoupled Plasma Source Technology: Process Region Choices For Silicide Etching
- A Manufacturable HDP Oxide Filled STI Process with SiN Liner for the Deep Sub-Micron Inter-Well Isolation
- Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies