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Advanced Technology Research Section LSI division Kawasaki Steel Corp. | 論文
- Conformal Chermical Vapor Deposition TiN(111) Film Formation as an Underlayer of Al for Highly Reliable Interconnects
- Characterization of Direct-Contact Via Plug Formed by Using Selective Aluminum Chemical Vapor Deposition
- Extremely Low ON-resistance Metal-to-Metal Antifuses with Al–Cu/10 nm-thick p-SiNx/Al–Cu Structure for Next Generation Very High Speed FPGAs (Field Programmable Gate Arrays)
- Extremely Low ON-Resistance Metal to Metal Antifuses with Al/p-SiN/Al Structure for Next Generation FPGAs