Heo Yuseon | School of Chemical Engineering & Material Science, Chung-Ang University
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School of Chemical Engineering & Material Science, Chung-Ang University | 論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics