Park Kihyun | Department of Precision and Mechanical Engineering, Pusan National Univeristy, Jangjeon-dong, Geumjeong-gu, Busan 609-735, Korea

スポンサーリンク

概要

• Park Kihyunの詳細を見る
• 同名の論文著者
• Department of Precision and Mechanical Engineering, Pusan National Univeristy, Jangjeon-dong, Geumjeong-gu, Busan 609-735, Koreaの論文著者

関連著者

• Jeong Haedo

  School Of Mechanical Engineering Pusan National University

• Park Kihyun

  Department Of Precision Mechanical Engineering Pusan National University

• Park Kihyun

  Department of Precision and Mechanical Engineering, Pusan National Univeristy, Jangjeon-dong, Geumjeong-gu, Busan 609-735, Korea

• Jeong Haedo

  School of Mechanical Engineering, Pusan National University

• Park Kihyun

  Department of Precision Mechanical Engineering, Pusan National University

• Choi Jaeyoung

  Department of Precision Mechanical Engineering, Pusan National University

• Jung Jaewoo

  Department of Precision Mechanical Engineering, Pusan National University

• Park Jaehong

  Rohm and Haas

• Kinoshita Masaharu

  Rohm and Haas

• Jung Jaewoo

  Department Of Precision Mechanical Engineering Pusan National University

• Choi Jaeyoung

  Department Of Precision Mechanical Engineering Pusan National University

• Jeong Sukhoon

  Department of Precision and Mechanical Engineering, Pusan National Univeristy, Jangjeon-dong, Geumjeong-gu, Busan 609-735, Korea

• Lee Sangjik

  Department of Precision and Mechanical Engineering, Pusan National Univeristy, Jangjeon-dong, Geumjeong-gu, Busan 609-735, Korea

• Kim Hyoungjae

  Dongnam Technology Service Division, Transportation and Machinery Components Technology Service Center, Korea Institute of Industrial Technology, Jisa-dong, Gangseo-gu, Busan 618-230, Korea

• Kim Hyoungjae

  Dongnam Technology Service Division, Transportation and Machinery Components Technology Service Center, Jisa-dong, Gangseo-gu, Busan 618-230, Korea

もっと見る 閉じる

著作論文

• A Study on Manufacture and Evaluation of CMP pad with Controllable Contact Area(Surface and edge finishing)
• Kinematical Modeling of Pad Profile Variation during Conditioning in Chemical Mechanical Polishing

スポンサーリンク