Chonan Yasunori | Department Of Electronics And Information System Faculty Of System Science And Technology Akita Pref
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Department Of Electronics And Information System Faculty Of System Science And Technology Akita Pref | 論文
- High-Temperature Thick Al Wire Bonding Technology for High-Power Modules
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating