Liu P‐t | National Nano Device Lab. Hsin‐chu Twn
スポンサーリンク
概要
関連著者
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Sze S‐m
National Nano Device Lab. Hsinchu Twn
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CHANG Ting-Chang
Department of Physics, National Sun Yat-Sen University
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SZE Simon
National Nano Device Laboratory
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LIU Po-Tsun
Department of Photonics and Display Institute, National Chiao Tung University
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Sze S
National Chiao‐tung Univ. Hsinchu Twn
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Sze Simon
Department Of Electronics Engineering And Institute Of Electronics National Chiao-tung University:na
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Sze Simon-m.
National Nano Device Laboratory
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LIU Po-Tsun
National Nano Device Laboratory
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Chang T‐c
Department Of Physics National Sun Yat-sen University
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Liu Po-tsun
Department Of Photonics And Display Institute National Chiao Tung University
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Chang Ting-chang
Department Of Physics National Sun Yat-sen University
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Liu P‐t
National Nano Device Lab. Hsin‐chu Twn
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Liu Po-Tsun
Department of Electronics Engineering and Institute of Electronics, National Chiao-Tung University
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YANG Ya-Liang
National Nano Device Laboratory
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Chang Ting-chang
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Lee J‐k
School Of Materials Science & Engineering College Of Engineering Seoul National University
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CHANG Ting-Chang
National Nano Device Laboratories
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HU Jung-Chih
Department of Materials Science and Engineering, National Tsing-Hua University
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CHENG Yi-Fang
Institute of Materials Science and Engineering, National Chiao Tung University
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SHIH Fu-Yung
Dow Corning Taiwan Inc.
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LEE Jae-Kyun
Dow Corning Taiwan Inc.
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TSAI Eric
Dow Corning Taiwan Inc.
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MOR Yi-Shian
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University
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Lee Jung-kun
School Of Materials Science And Engineering Seoul National University
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Cheng Yi-fang
Institute Of Materials Science And Engineering National Chiao Tung University
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Hu Jung-chih
Department Of Materials Science And Engineering National Tsing-hua University
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Mor Y‐s
National Chiao Tung Univ. Hsin‐chu Twn
著作論文
- Enhancement of Barrier Properties in Chemical Vapor Deposited TiN Employing Multi-Stacked Ti/TiN Structure
- Effectively Blocking Copper Diffusion at Low-k Hydrogen Silsesquioxane/Copper Interface
- Enhancing the Oxygen Plasma Resistance of Low-k Methylsilsesquioxane by H_2 Plasma Treatment