Onuki J | Department Of Materials Science And Engineering Ibaraki University
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概要
Department Of Materials Science And Engineering Ibaraki University | 論文
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- Effect of additive-free plating and high heating rate annealing on the formation of low resistivity fine Cu wires
- 多結晶銅薄膜の粒成長に及ぼす不純物の影響