PARK Heungsoo | Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
スポンサーリンク
概要
関連著者
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PARK Heungsoo
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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Park Heungsoo
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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CHUNG U-In
Process Development Thani, Semiconductor R&D Division, Sam suns Uectronics Co., Ltd.
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LEE Moon-Yong
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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Kim Ki-bum
Research Institute Of Advanced Materials School Of Materials Science And Engineering Seoul National
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Chung U-in
Process Development Team Memory Division Samsung Electronics Co. Ltd.
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Kim K‐b
Kwangwoon Univ. Seoul Kor
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Lee Moon-yong
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Kim Ki-byoung
Rfic Research And Education Center; Kwangwoon University
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Cho Y‐j
Osaka Univ. Osaka Jpn
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Leep Moon-yong
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Koh Young-bum
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Hong C‐k
National Kaohsiung Inst. Technol. Kaohsiung Twn
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Park H
Hynix Semiconductor Inc. Cheongju‐si Kor
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CHO Yong-Jun
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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SONG Jae-In
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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KIM Kwang-Bok
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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HONG Chang-Ki
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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Cho Yong-jun
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Song Jae-in
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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CHUNG U-In
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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Hong Chang-Ki
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
著作論文
- A New Post-Treatment for Chemical-Mechanical Polishing Process of Very Large-Scale Integrated Circuit Tungsten Vias
- Control of Microscratches in Chemical-Mechanical Polishing Process for Shallow Trench Isolation