A New Post-Treatment for Chemical-Mechanical Polishing Process of Very Large-Scale Integrated Circuit Tungsten Vias
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1998-07-15
著者
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Cho Y‐j
Osaka Univ. Osaka Jpn
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Leep Moon-yong
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Koh Young-bum
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Park H
Hynix Semiconductor Inc. Cheongju‐si Kor
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PARK Heungsoo
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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CHO Yong-Jun
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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SONG Jae-In
Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., Ltd.
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Cho Yong-jun
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Park Heungsoo
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
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Song Jae-in
Process Development Team Semiconductor R&d Center Samsung Electronics Co. Ltd.
関連論文
- Self-Induced Transparency Phenomena of Single-Mode Pulse Laser Propagating in a Thick Ytterbium Vapor Column
- A New Post-Treatment for Chemical-Mechanical Polishing Process of Very Large-Scale Integrated Circuit Tungsten Vias
- Control of Microscratches in Chemical-Mechanical Polishing Process for Shallow Trench Isolation