Park Sang-duk | Department Of Materials Engineering Sungkyunkwan University
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概要
関連著者
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Park Sang-duk
Department Of Materials Engineering Sungkyunkwan University
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Yeom Geun-young
Department Of Materials Engineering Sungkyunkwan University
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Hong Moon-pyo
Amlcd Division Samsung Electronics Co. Ltd.
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Yoon Byoung-young
Department Of Materials Science & Engineering Sungkyunkwan University
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Lee Young-joon
Department Of Earth And Environmental Sciences Korea University
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MIN Kyung-Suk
Department of Materials Science & Engineering, Sungkyunkwan University
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LEE Do-Haing
Department of Materials Science & Engineering, Sungkyunkwan University
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Song Byoung-kwan
Department Of Materials Engineering Sungkyunkwan University
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Kim Sang-gab
Amlcd Division Samsung Electronics Co. Ltd.
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Choe Hee-hwan
Amlcd Division Samsung Electronics Co. Ltd.
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YEOM Geun-Young
Department of Materials Engineering, Sungkyunkwan University
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Lee Young-joon
Department Of Materials Engineering Sungkyunkwan University
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KIM Sang-Gab
AMLCD Division, Samsung Electronics Co., Ltd.
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CHOE Hee-Hwan
AMLCD Division, Samsung Electronics Co., Ltd.
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Yeom Geun-Young
Department of Materials Science & Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, Korea
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Min Kyung-Suk
Department of Materials Science & Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, Korea
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Lee Do-Haing
Department of Materials Science & Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, Korea
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Park Sang-Duk
Department of Materials Engineering, SungKyunKwan University, Suwon, Kyunggi-do 440-746, Korea
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Choe Hee-Hwan
AMLCD Division, Samsung Electronics Co., Ltd., Yongin 449-771, Korea
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Yeom Geun-Young
Department of Materials Engineering, SungKyunKwan University, Suwon, Kyunggi-do 440-746, Korea
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Hong Moon-Pyo
AMLCD Division, Samsung Electronics Co., Ltd., Yongin 449-771, Korea
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Kim Sang-Gab
AMLCD Division, Samsung Electronics Co., Ltd., Yongin 449-771, Korea
著作論文
- Precise Depth Control of Silicon Etching Using Chlorine Atomic Layer Etching
- Characteristics of Ag Etching using Inductively Coupled Cl_2-based Plasmas
- Precise Depth Control of Silicon Etching Using Chlorine Atomic Layer Etching
- Characteristics of Ag Etching using Inductively Coupled Cl2-based Plasmas