Kim Jong-min | School Of Mechanical Engineering Chung-ang University
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概要
School Of Mechanical Engineering Chung-ang University | 論文
- Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
- Spectral and Angular Responses of Surface Plasmon Resonance Based on the Kretschmann Prism Configuration
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)