Kim Woo | Advanced Technology Development Team
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概要
Advanced Technology Development Team | 論文
- Shallow Trench Isolation Characteristics with High-Density-Plasma Chemical Vapor Deposition Gap-Fill Oxide for Deep-Submicron CMOS Technologies
- Investigation on the Body Bias Dependency of Gate Induced Drain Leakage Current in the Body-Tied finFET
- RC-FinFET (Recessed Channel FinFET) Cell Transistor Technology for Future Generation DRAMs
- Shallow Trench Isolation Characteristics with High-Density-Plasma (HDP) CVD Oxide for Deep-Submicron CMOS Technologies
- Shallow Trench Isolation Characteristics with High-Density-Plasma (HDP) CVD Oxide for Deep-Submicron CMOS Technologies