Tobita Toshimi | Hitachi Kyowa Engineering Co., Ltd., Hitachi, Ibaraki 319-1292, Japan
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Hitachi Kyowa Engineering Co., Ltd., Hitachi, Ibaraki 319-1292, Japan | 論文
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects