Arai E. | Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Department of Manufacturing Science, Graduate School of Engineering, Osaka University | 論文
- Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
- Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
- Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
- Electron-Impact Double Ionization of Ba^+
- Water Motion in a Water Curtain Head for Cleaning a Large Glass Plate