Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing

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概要

• 論文の詳細を見る

• In this study, the surface topographies of chemical mechanical polishing (CMP) pad samples for varying levels of diamond microwear of a conditioner have been measured using a confocal microscope and an X-ray computer tomography (CT) scanner. The experimental results showed that the increase in the pad debris on the pad surface reduced the pad height ratio of the asperity called the ``top surface area (TSA) ratio''. In addition, the overall removal rate in tungsten CMP was more dependent on the TSA ratio after polishing than on that after conditioning because the pad surface condition became worse with deformed asperities and micropores due to the insufficient conditioning.

• 2011-05-25

著者

• Yamada Yohei

  Micro Device Division, Hitachi, Ltd., 6-16-3 Shinmachi, Ome, Tokyo 198-8512, Japan

• Kawakubo Masanori

  Micro Device Division, Hitachi, Ltd., 6-16-3 Shinmachi, Ome, Tokyo 198-8512, Japan

• Kadomura Kazunori

  Semiconductor Group, A.L.M.T. Corporation, Osaka 550-0003, Japan

• Kawakubo Masanori

  Micro Device Division, Hitachi, Ltd., Ome, Tokyo 198-8512, Japan

関連論文

• Frictional Characterization of Chemical–Mechanical Polishing Pad Surface and Diamond Conditioner Wear
• Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing
• Study on Factors in Time-Dependent Dielectric Breakdown Degradation of Cu/Low-$k$ Integration Related to Cu Chemical–Mechanical Polishing

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