On the Possibility of Accumulative Roll Bonding for the Strengthening of ODS(Oxide Dispersion Strengthened) Copper Alloy Sheets

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概要

• 論文の詳細を見る
• 日本伸銅協会の論文

著者

• KIM Su-Hyeon

  Korea Institute of Materials Science

関連論文

• Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film
• Evolution of Rolling Textures of Cold Rolled Copper Foils
• On the Possibility of Accumulative Roll Bonding for the Strengthening of ODS(Oxide Dispersion Strengthened) Copper Alloy Sheets

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