Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

スポンサーリンク

概要

• 論文の詳細を見る
• 2010-04-01

著者

• KIM Su-Hyeon

  Korea Institute of Materials Science

• KANG Joo-Hee

  Korea Institute of Materials Science

• HAN Seung

  Korea Institute of Materials Science

関連論文

• Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film
• Evolution of Rolling Textures of Cold Rolled Copper Foils
• On the Possibility of Accumulative Roll Bonding for the Strengthening of ODS(Oxide Dispersion Strengthened) Copper Alloy Sheets
• Effect of Shear Strain on the Microstructural Evolution of a Low Carbon Steel during Warm Deformation
• Effect of Strain on Microstructural Evolution under Warm Deformation in an Ultra-Low Carbon Steel

スポンサーリンク