Fine-Pitch Copper Wiring Formed with Super-Inkjet and Oxygen Pump
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概要
- 論文の詳細を見る
We have successfully printed wires of 5 μm line widths and spaces in copper nanoparticle ink with a super-inkjet printer. The wires show resistivity as low as 8.1 μ\Omega\cdotcm after sintering at 250 °C in an extremely low oxygen atmosphere generated by an oxygen pump. To our knowledge, this is the first report of micron-scale copper wiring formed by a direct printing method without any masks or templates.
- 2013-05-25
著者
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NAKAMOTO Masami
Osaka Municipal Technical Research Institute
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Kashiwagi Yukiyasu
Osaka Municipal Technical Research Institute
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Shirakawa Naoki
Flexible Electronics Research Center, AIST Tsukuba Central 4, Tsukuba, Ibaraki 305-8562, Japan
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Kojima Toshifumi
NGK Spark Plug Co., Ltd., Komaki, Aichi 485-8510, Japan
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Murata Kazuhiro
Flexible Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8562, Japan
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Kajihara Yasukazu
IOX Co., Ltd., Higashiosaka, Osaka 577-0835, Japan
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Nakamura Katsuhiro
IOX Co., Ltd., Higashiosaka, Osaka 577-0835, Japan
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Sato Hironori
NGK Spark Plug Co., Ltd., Komaki, Aichi 485-8510, Japan
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Komiya Daisuke
SIJTechnology, Inc., Tsukuba, Ibaraki 305-8565, Japan
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Shimizu Kotaro
SIJTechnology, Inc., Tsukuba, Ibaraki 305-8565, Japan
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Masuda Kazuyuki
SIJTechnology, Inc., Tsukuba, Ibaraki 305-8565, Japan
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Shirakawa Naoki
Flexible Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8562, Japan
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Kashiwagi Yukiyasu
Osaka Municipal Technical Research Institute, Osaka 536-8553, Japan
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