Design, Fabrication, and Actuation of Micro-Electro-Mechanical System-Based Image Stabilizer
スポンサーリンク
概要
- 論文の詳細を見る
In this investigation, we present a two dimensional high aspect ratio $XY$ stage, designed as an image stabilizer. This stabilizer is $8\times 8\times 0.75$ mm3, and sufficiently strong to support a suspended image sensor for anti-shaking photographic function. This stabilizer is fabricated by the silicon-on-glass (SOG) process including inductively coupled plasma reactive ion etching (ICP-RIE) processes, in which the anchor layer, pre-etching layer and structure layers are identified without an additional release step as is required in traditional silicon-on-insulator (SOI) wafer etching process. When an actuator is fabricated, flip-chip bonding is adopted to attach a 3 megapixel image sensor to this device. The longest calculated traveling distance of the stabilizer is 25 μm and special stoppers are designed to prevent the actuator from moving out of range, and sticking to the side by pull-in phenomenon. Accordingly, the applied voltage at the 25 μm moving distance is 84 V. Furthermore, the dynamic resonant frequency of the actuating device with an image sensor is 1.013 kHz.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2010-01-25
著者
-
Lin Chun-Ying
Department of Electrical and Control Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.
-
Chiou Jin-Chern
Department of Electrical and Control Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.
-
Hung Chen-Chun
Department of Electrical and Control Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.
-
Lin Yung-Jiun
Department of Electrical and Control Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.
関連論文
- Development of Vertical Electrostatic Comb-Drive Actuator Using Magnified Cascade Configuration
- Design, Fabrication, and Actuation of Micro-Electro-Mechanical System-Based Image Stabilizer