Thermal Imprint Lithography onto Filler Incorporated Composite Resin

概要

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Thermal imprint lithography was investigated for application to printed circuit boards. Features in size ranging from 6 to 100 μm were successfully transferred onto an epoxy-based thermoset resin with a filler (SiO2) content of approximately 38 vol %. An apparent increase in imprinted pattern width was observed and attributed to an increase in the filler content inside the pattern. Resin-filler interaction was shown to be an important factor in the observed pattern dimension when a filler incorporated composite resin was used for thermal imprint lithography. Control of the squeezing flow during imprinting was crucial for the pattern transfer fidelity.
Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
2009-06-25