Simulation and Experimental Study on Recovery of Polymer during Hot Embossing
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概要
- 論文の詳細を見る
The recovery of polymer caused by the stress in polymer has a significant effect on the imprinting accuracy in three-dimensional (3D) hot embossing lithography (HEL). A method is proposed in this paper to simulate the recovery defect of a 3D structure. The filling characteristics of polymer and the stress distribution in polymer are analyzed using a combination model of non-Newtonian fluid and linear-elastic solid. The recovery of polymer after demolding is predicted by simulating the process of stress release. The good agreement between simulation and experimental results with an error of structure depth under 4% indicates that the proposed method is effective in optimizing the process parameters, and it can therefore be used to reduce the recovery of polymer thereby improving the 3D imprinting accuracy.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2009-06-25
著者
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Wang Zhe
School Of Computer And Information Technol. Beijing Jiaotong Univ.
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Jin Peng
Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology, Harbin 150080, China
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Gao Yulong
Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology, Harbin 150080, China
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Liu Tingting
Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology, Harbin 150080, China
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Tan Jiubin
Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology, Harbin 150080, China
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Zhou Haoran
Department of Polymer Materials and Engineering, Harbin University of Science and Technology, Harbin 150040, China
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Wang Zhe
School of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
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- Simulation and Experimental Study on Recovery of Polymer during Hot Embossing