Optimization of Stress Memorization Technique for 45 nm Complementary Metal–Oxide–Semiconductor Technology
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概要
- 論文の詳細を見る
The effect of stress memorization technique (SMT) on performance of transistors and power reduction is intensively studied. A 30% mobility enhancement and 60% reduction of gate leakage have been achieved simultaneously by choosing the appropriate stressor film with a large stress change by spike rapid thermal annealing (RTA). Stress distribution in the channel region for SMT is confirmed to be uniform; hence, the layout dependence is minimized and the performance is maximized in aggressively scaled complementary metal–oxide–semiconductor (CMOS) with dense gate pitch rule (190 nm) in 45 nm technology node.
- 2009-03-25
著者
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Sanuki Tomoya
System LSI Division, Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan
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Matsuoka Fumitomo
System LSI Division, Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan
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Morifuji Eiji
System LSI Division, Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan
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Eiho Ayumi
System LSI Division, Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan
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Iwai Masaaki
System LSI Division, Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan
関連論文
- Optimization of Stress Memorization Technique for 45 nm Complementary Metal–Oxide–Semiconductor Technology
- The Impact of Technology Scaling for RF Complementary Metal–Oxide–Semiconductor