Effect of the Ingot Cooling on the Grown-in Defects in Silicon Czochralski Growth
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概要
- 論文の詳細を見る
208 mm diameter single crystals are grown by Czochralski method with different growing conditions, and the effects of the ingot cooling on point defect behavior and the shape of the crystal–melt interface are experimentally investigated. In order to obtain various cooling rates of the ingot, cooling-water jacket is changed with various surface conditions, which are different emissivities of the material, and various melt gaps are applied in the experiments, where melt gap is defined as the distance from heat shield to the melt free-surface. The crystal–melt interface becomes more concave (convex to the crystal) and the critical pulling speed for defect-free crystal increases with increasing cooling rate of the ingot.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2009-10-25
著者
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Lee Hong-Woo
Growing Technology Development Team, Siltron, Simi-dong, Gumi, Gyeong-buk 730-340, Korea
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Sim Bok-Cheol
Growing Technology Development Team, Siltron, Simi-dong, Gumi, Gyeong-buk 730-340, Korea
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Jung Yo-Han
Growing Technology Development Team, Siltron, Simi-dong, Gumi, Gyeong-buk 730-340, Korea
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Sim Bok-Cheol
Growing Technology Development Team, Siltron, Gumi, Gyeongbuk 730-340, Korea
関連論文
- Micro Defect Size in Si Single Crystal Grown by Czochralski Method
- Effect of the Ingot Cooling on the Grown-in Defects in Silicon Czochralski Growth