Feed-Horn Antenna for Enhanced Uncooled Infrared Sensor Using Novel UV Lithography, Plastic Micromachining and Mesh Structure Bonding

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概要

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• In this paper, we report a uncooled infrared sensor coupled with a 3-dimensional (3D) feed-horn shape micro-electro-mechanical system (MEMS) antenna using novel UV lithography technique for fabricating a 3D feed-horn-shaped mold array, obtaining parallel light using a mirror-reflected parallel-beam illuminator (MRPBI) system and plastic micromaching. The microassembly of infrared detector and 3D feed-horn-shaped antenna arrays is difficult using the conventional MEMS bonding process. To overcome limitation, the proposed novel 3D MEMS bonding technique is mesh structure bonding (MSB) using microchannels with micromolding in capillaries by polydimethylsiloxane (PDMS). The feasibility of fabricating both a 3D feed-horn MEMS antenna and a mold array was demonstrated. As a result, it seems possible to use a 3D feed-horn-shaped MEMS antenna to improve uncooled infrared sensor performance and applications to fabricate MEMS device.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2004-06-15

著者

• Shin Hyun-joon

  Microsystems Research Center Korea Institute Of Science And Technology

• Pak James

  Department of Electrical Engineering, Korea University, Seoul 136-701, Korea

• Moon Sung

  Microsystem Research Center, Korea Institute of Science and Technology, Seoul 136-791, Korea

• Kim Kun-Tae

  Microsystems Research Center, Korea Institute of Science and Technology, P.O. BOX 131, Cheongryang, Seoul, Korea

• Park Jong-Yeon

  Microsystems Research Center, Korea Institute of Science and Technology, P.O. BOX 131, Cheongryang, Seoul, Korea

• Moon Sung

  Microsystems Research Center, Korea Institute of Science and Technology, P.O. BOX 131, Cheongryang, Seoul, Korea

関連論文

• Fabrication and Mechanical Characterization of Micro Electro Mechanical System Based Vertical Probe Tips for Micro Pad Measurements
• Feed-Horn Antenna for Enhanced Uncooled Infrared Sensor Using Novel UV Lithography, Plastic Micromachining and Mesh Structure Bonding

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