Schottky Junction Devices with a Free-Standing Semiconductor Polymer Film Prepared by Peeling-Off Transfer Technique
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概要
- 論文の詳細を見る
A novel electrode preparation technique for free-standing semiconductor polymer films compatible with reel-to-reel production, the peeling-off transfer technique, has been proposed. This technique can remove the flipping process from the preparation of sandwich-type devices with a free-standing semiconductor polymer film, and can provide easier positioning between upper and lower electrodes. It has been shown that the Schottky junction devices using the conjugated polymer poly(3-hexylthiophene) made through this technique have essentially identical characteristics to those made by direct vacuum deposition techniques. Although we used a conjugated polymer film to test our idea, this technique can easily be applied to any flexible semiconductor films with adequate surface and mechanical properties.
- Japan Society of Applied Physicsの論文
- 2003-03-15
著者
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Tada Kazuya
Division Of Electrical Engineering Graduate School Of Engineering University Of Hyogo
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NISHIYAMA Hitoshi
Division of Electrical Engineering, Himeji Institute of Technology
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Onoda Mitsuyoshi
Division Of Electrical Engineering Graduate School Of Engineering University Of Hyogo
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Onoda Mitsuyoshi
Division of Electrical Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji 671-2201, Japan
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Tada Kazuya
Division of Electrical Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji 671-2201, Japan
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Nishiyama Hitoshi
Division of Electrical Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji 671-2201, Japan
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