Process Evaluation of Directed Self-assembly Lithography using Simulation Method based on Self-consistent Field Theory
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概要
- 論文の詳細を見る
We have investigated the process margin for fabrication of line/space directed self-assembled (DSA) patterns using a simulation method based on self-consistent field theory. We studied three systems, namely, chemoepitaxial DSA using lamellar-forming block copolymers (BCPs), graphoepitaxial DSA using lamellar-forming BCPs, and graphoepitaxial DSA using cylindrical BCPs. In the case of the chemoepitaxial DSA, both the subtle change of the wetting condition and the topography of the prepattern surface were found to strongly affect the process margin of the pinning layer width. In the case of the graphoepitaxial DSA using cylindrical BCPs, both the pattern pitch and CD of the forming DSA cylindrical patterns were found to intensely depend on both the trench width and the film thickness of the BCPs.
- The Society of Photopolymer Science and Technology (SPST)の論文
著者
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Kihara Naoko
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Kasahara Yusuke
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Kanai Hideki
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Kodera Katsuyoshi
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Sato Hironobu
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Kobayashi Katsutoshi
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Miyagi Ken
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Minegishi Shinya
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Tobana Toshikatsu
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Fujiwara Tomoharu
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Hirayanagi Noriyuki
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Kawamonzen Yoshiaki
DSA Research Dept., EUVL Infrastructure Development Center, Inc.
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Azuma Tsukasa
DSA Research Dept., EUVL Infrastructure Development Center, Inc.