Dynamic thermal management for 3D multicore processors under process variations

スポンサーリンク

概要

• 論文の詳細を見る

• Stacking core layers is emerging as an alternative for future high performance computing, but thermal problems have to be tackled first. When adaptive voltage scaling is adopted to hide the growing variation in the performance of cores, as a result, heat generation of each core varies. By exploiting the static thermal characteristics, the efficiency of dynamic thermal management can be improved. The proposed thermal management reduces the energy consumption by up to 30.02% compared with existing techniques, while keeping the ratio of temperature violations around 1%.

• The Institute of Electronics, Information and Communication Engineersの論文

著者

• HONG Hyejeong

  School of Electrical & Electronic Eng., Yonsei University

• KANG Sungho

  School of Electrical & Electronic Eng., Yonsei University

• Lim Jaeil

  School of Electrical and Electronic Engineering, Yonsei University

• Lim Hyunyul

  School of Electrical and Electronic Engineering, Yonsei University

関連論文

• A Hardware-Efficient Pattern Matching Architecture Using Process Element Tree for Deep Packet Inspection
• Thermal-aware dynamic voltage frequency scaling for many-core processors under process variations
• Acceleration of Deep Packet Inspection Using a Multi-Byte Processing Prefilter
• Dynamic thermal management for 3D multicore processors under process variations

スポンサーリンク