Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics

スポンサーリンク

概要

• 論文の詳細を見る

• Boiling heat transfer is a superior heat transfer technology using the latent heat transport with phase-change. However, it has been difficult to employ as a cooling technology for electronics because the unstable transition boiling and film boiling with excessive high temperature are impossible to control. In highly subcooled boiling, the coalescing bubbles formed on the heating surface collapse to many fine bubbles at the beginning of transition boiling and the heat flux exceeds the critical heat flux. This boiling regime has been called Microbubble Emission Boiling (MEB). Two models of cooling device are introduced using subcooled flow boiling with MEB for power electronics, where the maximum heat flux is 500 W/cm2 (5 MW/m2).

著者

• SUZUKI Koichi

  Tokyo Metropolitan Institute of Gerontology

• Mochizuki Masataka

  Thermal Tech. Div., Fujikura Corp.

• Suzuki Koichi

  Tokyo University of Science

• Yuki Kazuhisa

  Tokyo University of Science

関連論文

• Fundamental Experiments and Numerical Analyses on Heat Transfer Characteristics of a Vapor Chamber : Effect of Heat Source Size
• Heterogeneous Nuclear Ribonucleoprotein K Interacts with and Is Proteolyzed by Calpain in vivo(Biochemistry & Molecular Biology)
• Theoretical Study on Heat Transfer Characteristics of a Vapor Chamber
• The Structure of Calpain
• Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics
• H212 Heat Pipe Based Emergency Core Cooling System for Nuclear Reactor
• S051024 Heat Pipe Based Pre Cooler and Emergency Cooling Systems for Data Center Energy Conservation
• Development of Functional Porous Heat Sink for Cooling High-Power Electronic Devices

スポンサーリンク