High-Throughput UV Nanoimprint Process Using Flexible Resin Mold for High-Brightness Light-Emitting Diodes (特集 MEMSパッケージングと微細加工技術)

概要

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This paper demonstrated a high-throughput fabrication process of resin mold and nanostructures for high-brightness light-emitting diodes (LED). The fabrication process includes roll-to-roll (RtR) UV imprinting for resin mold fabrication and perpendicular UV imprinting on wafers. The measurement results of pattern sizes in UV imprinted sample indicate that the resin mold was uniform enough to use for subsequent UV imprinting, and highly uniform UV imprinting was achieved by means of developed high-throughput UV imprinting equipment. Thickness of the residual layer was highly uniform and repeatable. This fabrication process is expected to be applied to fabricate nanostructures for actual high-brightness LEDs.
電気学会の論文