超音波音響粘性力と空気静圧を組み合わせた非接触基板搬送路 (第一報) : —非接触ガイド機能の開発—

概要

論文の詳細を見る
In recent years, the size of plane substrates and semiconductor wafers has increased. As conventional contact transportation systems composed of, for example, carrier rollers, belt conveyers, and robot hands carry these longer and wider substrates, the increased weight of substrate results in increased potential for fracture. A non-contact transportation system is required to solve this problem. I propose a new non-contact transportation system combining acoustic viscous and aerostatic forces to provide damage-free transport. In this system, substrates are supported by aerostatic force and transported by acoustic viscous streaming induced by traveling wave deformation of a disk-type stator. Two non-contact guiding techniques to avoid substrates drop off from the transporter. One is hybrid type consists of stators, which have transportation and guiding function, set on the both side of transporter. The other is discrete type consists of stators and guide units separately. The guide unit has a plate oscillates with a standing wave of fundamental mode to excite non-contact holding/ guiding force. We constructed a non-contact transport apparatus for polycrystalline silicon wafers (150(W) × 150(L) × 0.3(t)). The stator with piezoelectric actuators for hybrid type performs holding thrust force of 0.37mN. On the other hand, one guide unit produces the holding force of 20mN
公益社団法人精密工学会の論文