1A2-B05 超音波振動を利用した基板の非接触搬送技術(第三報) : ガラス基板の非接触搬送特性

概要

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In recent years, various boards such as glass substrate and semiconductor wafers have become larger. Therefore, fracture of substrates under conventional contact transportation is unavoidable. In order to solve these problems, a new non-contact transportation technology is proposed. The board is levitated by aerostatic force and held by the holding unit constructed by oscillating plate actuated by bolted Langevin transducer. In this paper, two oscillating plates are proposed. One is 7 times wider than conventional oscillating plate. The other, which is called comb type has 6 slits to define individual oscillation. The comb type has holding performance with spring constant of 17mN/mm. The dynamic spring constant, which was verified by undamped natural frequency for step response, was comparable to static spring constant.
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