微粒子への電気めっきにおける最適電解槽の構造決定

概要

論文の詳細を見る
In electroplating individual fine particles, it is important that the particle suspension layer be stirred homogeneously while being kept at a high concentration. A study was therefore conducted on to determine the most suitable apparatus and appropriate conditions for stirring with a view to improving such powder characteristics as the free-settling ratio and angle of repose in water in particle plating. The results obtained we are as follows;(1)Both tilting and vertical plating apparatus are highly suitable for particle plating.(2)The conditions of particle plating are affected not only by particle diameter but also free-settling ratio and the angle of repose in water, because density, shape, secondary aggregation and so on are different for each type of particle.(3)The tilting angle and rotational speed of tilting apparatus must be properly controlled, and the pitch, size and propeller speed of the vertical type must be suitably adjusted in accordance with the free-settling ratio and angle of repose in water.
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